TY - JOUR

T1 - Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

AU - Schipfer, Christian

AU - Gschwandl, Mario

AU - Fuchs, Peter

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Morak, Matthias

AU - Tao, Qi

AU - Schingale, Angelika

N1 - Publisher Copyright: © 2022 Elsevier Ltd

PY - 2022/12

Y1 - 2022/12

N2 - Surface Mounted Devices (SMDs) are widely used throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based encapsulations. Thus, enhanced lifetime assessment methods are necessary. To understand the stress situation in SMDs at the end of the production cycle, an improved model approach for the curing of EMC is implemented within Finite Element Analysis (FEA) simulations. During production, e.g., in a Resin Transfer Molding (RTM) process, material properties are spatially varying due to different curing degrees. Hence, a mismatch of mechanical properties is present, which in return leads to internal stresses. The introduced model approach is an extension of the work of Gschwandl et al. (2017) and includes a stress-free deformation before vitrification, changing material properties during curing, as well as plastic deformations and visco-elastic effects. The implementation in numerical FEA simulations allows for a better understanding of arising residual stresses and helps optimize the production cycle of SMDs.

AB - Surface Mounted Devices (SMDs) are widely used throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based encapsulations. Thus, enhanced lifetime assessment methods are necessary. To understand the stress situation in SMDs at the end of the production cycle, an improved model approach for the curing of EMC is implemented within Finite Element Analysis (FEA) simulations. During production, e.g., in a Resin Transfer Molding (RTM) process, material properties are spatially varying due to different curing degrees. Hence, a mismatch of mechanical properties is present, which in return leads to internal stresses. The introduced model approach is an extension of the work of Gschwandl et al. (2017) and includes a stress-free deformation before vitrification, changing material properties during curing, as well as plastic deformations and visco-elastic effects. The implementation in numerical FEA simulations allows for a better understanding of arising residual stresses and helps optimize the production cycle of SMDs.

KW - Curing simulation

KW - D2PAK

KW - Finite-element-simulation

KW - Heating cycle

KW - Process optimization

KW - Residual stresses

UR - http://www.scopus.com/inward/record.url?scp=85140025400&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2022.114799

DO - 10.1016/j.microrel.2022.114799

M3 - Article

AN - SCOPUS:85140025400

VL - 139.2022

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - December

M1 - 114799

ER -