Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
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In: Microelectronics Reliability, Vol. 139.2022, No. December, 114799, 12.2022.
Research output: Contribution to journal › Article › Research › peer-review
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TY - JOUR
T1 - Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
AU - Schipfer, Christian
AU - Gschwandl, Mario
AU - Fuchs, Peter
AU - Antretter, Thomas
AU - Feuchter, Michael
AU - Morak, Matthias
AU - Tao, Qi
AU - Schingale, Angelika
N1 - Publisher Copyright: © 2022 Elsevier Ltd
PY - 2022/12
Y1 - 2022/12
N2 - Surface Mounted Devices (SMDs) are widely used throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based encapsulations. Thus, enhanced lifetime assessment methods are necessary. To understand the stress situation in SMDs at the end of the production cycle, an improved model approach for the curing of EMC is implemented within Finite Element Analysis (FEA) simulations. During production, e.g., in a Resin Transfer Molding (RTM) process, material properties are spatially varying due to different curing degrees. Hence, a mismatch of mechanical properties is present, which in return leads to internal stresses. The introduced model approach is an extension of the work of Gschwandl et al. (2017) and includes a stress-free deformation before vitrification, changing material properties during curing, as well as plastic deformations and visco-elastic effects. The implementation in numerical FEA simulations allows for a better understanding of arising residual stresses and helps optimize the production cycle of SMDs.
AB - Surface Mounted Devices (SMDs) are widely used throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based encapsulations. Thus, enhanced lifetime assessment methods are necessary. To understand the stress situation in SMDs at the end of the production cycle, an improved model approach for the curing of EMC is implemented within Finite Element Analysis (FEA) simulations. During production, e.g., in a Resin Transfer Molding (RTM) process, material properties are spatially varying due to different curing degrees. Hence, a mismatch of mechanical properties is present, which in return leads to internal stresses. The introduced model approach is an extension of the work of Gschwandl et al. (2017) and includes a stress-free deformation before vitrification, changing material properties during curing, as well as plastic deformations and visco-elastic effects. The implementation in numerical FEA simulations allows for a better understanding of arising residual stresses and helps optimize the production cycle of SMDs.
KW - Curing simulation
KW - D2PAK
KW - Finite-element-simulation
KW - Heating cycle
KW - Process optimization
KW - Residual stresses
UR - http://www.scopus.com/inward/record.url?scp=85140025400&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2022.114799
DO - 10.1016/j.microrel.2022.114799
M3 - Article
AN - SCOPUS:85140025400
VL - 139.2022
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
IS - December
M1 - 114799
ER -