Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

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Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics. / Gschwandl, Mario; Friedrich, Birgit Ella; Pfost, Martin et al.
in: Microelectronics Reliability, Jahrgang 133.2022, Nr. June, 114537, 04.05.2022.

Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

Harvard

Gschwandl, M, Friedrich, BE, Pfost, M, Antretter, T, Fuchs, PF, Mitev, I, Tao, Q & Schingale, A 2022, 'Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics', Microelectronics Reliability, Jg. 133.2022, Nr. June, 114537. https://doi.org/10.1016/j.microrel.2022.114537

APA

Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q., & Schingale, A. (2022). Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics. Microelectronics Reliability, 133.2022(June), Artikel 114537. Vorzeitige Online-Publikation. https://doi.org/10.1016/j.microrel.2022.114537

Vancouver

Gschwandl M, Friedrich BE, Pfost M, Antretter T, Fuchs PF, Mitev I et al. Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics. Microelectronics Reliability. 2022 Mai 4;133.2022(June):114537. Epub 2022 Mai 4. doi: 10.1016/j.microrel.2022.114537

Author

Gschwandl, Mario ; Friedrich, Birgit Ella ; Pfost, Martin et al. / Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics. in: Microelectronics Reliability. 2022 ; Jahrgang 133.2022, Nr. June.

Bibtex - Download

@article{43444f7d8d194f769978e3baa9847b6b,
title = "Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics",
keywords = "Finite element analysis, Power electronics, Printed circuit boards, Reliability",
author = "Mario Gschwandl and Friedrich, {Birgit Ella} and Martin Pfost and Thomas Antretter and Fuchs, {Peter Filipp} and Ivaylo Mitev and Qi Tao and Angelika Schingale",
note = "Publisher Copyright: {\textcopyright} 2022",
year = "2022",
month = may,
day = "4",
doi = "10.1016/j.microrel.2022.114537",
language = "English",
volume = "133.2022",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
number = "June",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

AU - Gschwandl, Mario

AU - Friedrich, Birgit Ella

AU - Pfost, Martin

AU - Antretter, Thomas

AU - Fuchs, Peter Filipp

AU - Mitev, Ivaylo

AU - Tao, Qi

AU - Schingale, Angelika

N1 - Publisher Copyright: © 2022

PY - 2022/5/4

Y1 - 2022/5/4

KW - Finite element analysis

KW - Power electronics

KW - Printed circuit boards

KW - Reliability

UR - http://www.scopus.com/inward/record.url?scp=85129248926&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2022.114537

DO - 10.1016/j.microrel.2022.114537

M3 - Article

AN - SCOPUS:85129248926

VL - 133.2022

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - June

M1 - 114537

ER -

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