Thin Film Adhesion of Flexible Electronics Influenced by Interlayers
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in: Advanced engineering materials, Jahrgang 19.2017, Nr. 4, 1600665, 2017.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Thin Film Adhesion of Flexible Electronics Influenced by Interlayers
AU - Kleinbichler, Andreas
AU - Bartosik, Mattias
AU - Völker, Bernhard
AU - Cordill, Megan
PY - 2017
Y1 - 2017
UR - http://www.scopus.com/inward/record.url?scp=85006699583&partnerID=8YFLogxK
U2 - 10.1002/adem.201600665
DO - 10.1002/adem.201600665
M3 - Article
AN - SCOPUS:85006699583
VL - 19.2017
JO - Advanced engineering materials
JF - Advanced engineering materials
SN - 1438-1656
IS - 4
M1 - 1600665
ER -