Thin Film Adhesion of Flexible Electronics Influenced by Interlayers

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Thin Film Adhesion of Flexible Electronics Influenced by Interlayers. / Kleinbichler, Andreas; Bartosik, Mattias; Völker, Bernhard et al.
In: Advanced engineering materials, Vol. 19.2017, No. 4, 1600665, 2017.

Research output: Contribution to journalArticleResearchpeer-review

Vancouver

Kleinbichler A, Bartosik M, Völker B, Cordill M. Thin Film Adhesion of Flexible Electronics Influenced by Interlayers. Advanced engineering materials. 2017;19.2017(4):1600665. doi: 10.1002/adem.201600665

Author

Kleinbichler, Andreas ; Bartosik, Mattias ; Völker, Bernhard et al. / Thin Film Adhesion of Flexible Electronics Influenced by Interlayers. In: Advanced engineering materials. 2017 ; Vol. 19.2017, No. 4.

Bibtex - Download

@article{d6986d8799cb4bb694f477268f5f58c3,
title = "Thin Film Adhesion of Flexible Electronics Influenced by Interlayers",
author = "Andreas Kleinbichler and Mattias Bartosik and Bernhard V{\"o}lker and Megan Cordill",
year = "2017",
doi = "10.1002/adem.201600665",
language = "English",
volume = "19.2017",
journal = " Advanced engineering materials",
issn = "1438-1656",
publisher = "Wiley-VCH ",
number = "4",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Thin Film Adhesion of Flexible Electronics Influenced by Interlayers

AU - Kleinbichler, Andreas

AU - Bartosik, Mattias

AU - Völker, Bernhard

AU - Cordill, Megan

PY - 2017

Y1 - 2017

UR - http://www.scopus.com/inward/record.url?scp=85006699583&partnerID=8YFLogxK

U2 - 10.1002/adem.201600665

DO - 10.1002/adem.201600665

M3 - Article

AN - SCOPUS:85006699583

VL - 19.2017

JO - Advanced engineering materials

JF - Advanced engineering materials

SN - 1438-1656

IS - 4

M1 - 1600665

ER -