Size effect of thermal expansion and thermal/intrinsic stresses in nanostructured thin films: Experiment and model
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Size effect of thermal expansion and thermal/intrinsic stresses in nanostructured thin films: Experiment and model. / Daniel, Rostislav; Holec, David; Bartosik, Matthias et al.
in: Acta materialia, Jahrgang 59, 2011, S. 6631-6645.
in: Acta materialia, Jahrgang 59, 2011, S. 6631-6645.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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Daniel R, Holec D, Bartosik M, Keckes J, Mitterer C. Size effect of thermal expansion and thermal/intrinsic stresses in nanostructured thin films: Experiment and model. Acta materialia. 2011;59:6631-6645. doi: 10.1016/j.actamat.2011.07.018
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@article{9f95f40cde454466aa6d3b8c7d0170a6,
title = "Size effect of thermal expansion and thermal/intrinsic stresses in nanostructured thin films: Experiment and model",
author = "Rostislav Daniel and David Holec and Matthias Bartosik and Jozef Keckes and Christian Mitterer",
year = "2011",
doi = "10.1016/j.actamat.2011.07.018",
language = "English",
volume = "59",
pages = "6631--6645",
journal = "Acta materialia",
issn = "1359-6454",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Size effect of thermal expansion and thermal/intrinsic stresses in nanostructured thin films: Experiment and model
AU - Daniel, Rostislav
AU - Holec, David
AU - Bartosik, Matthias
AU - Keckes, Jozef
AU - Mitterer, Christian
PY - 2011
Y1 - 2011
U2 - 10.1016/j.actamat.2011.07.018
DO - 10.1016/j.actamat.2011.07.018
M3 - Article
VL - 59
SP - 6631
EP - 6645
JO - Acta materialia
JF - Acta materialia
SN - 1359-6454
ER -
