Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

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Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov. 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

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Numerical simulation of the failure behavior of PE pressure pipes with additional loads

Hutar, P., Sevcik, M., Nahlik, L., Mitev, I., Frank, A. & Pinter, G., 2009, ANTEC 2009 Society of Plastics Engineers' Annual Technical Conference. S. 2163-2168

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