Peng, C.,
Morak, M.,
Thalhamer, A.,
Gschwandl, M.,
Fuchs, P.,
Tao, Q.,
Krivec, T.,
Antretter, T. &
Celigueta, M. A.,
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).
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