Publikationen

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2023
Veröffentlicht
Residual Stress Evolution in Low-Alloyed Steel at Three Different Length Scales
Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 23 März 2023, in: Materials. 16.2023, 7, 17 S., 2568.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
On the road towards understanding squats: residual stress state of rails
Gschwandl, T. J., Daves, W., Antretter, T., Bucher, C. & Künstner, D., 2023, in: Procedia Structural Integrity. 46, S. 17-23 7 S.
Publikationen: Beitrag in Fachzeitschrift › Konferenzartikel › (peer-reviewed)
Veröffentlicht
Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens
Prabitz, K., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R., Polcik, P. & Ecker, W., 2023, XLI. Verformungskundliches Kolloquium.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides
Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.
Publikationen: Konferenzbeitrag › Poster › Forschung
Veröffentlicht
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
2022
Veröffentlicht
A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK): The Best Contributions of 2022’s STACK Community Meeting at the Montanuniversitaet Leoben, Austria
Orthaber, M. (Gastbeitragender), Antretter, T. (Gastbeitragender), Orthaber, M. & Antretter, T., 8 Dez. 2022, in: International journal emerging technologies in learning : iJET. 2022, Vol. 17 No. 23
Publikationen: Beitrag in Fachzeitschrift › Sonderausgabe/Sonderband › Forschung › (peer-reviewed)
Veröffentlicht
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dez. 2022, in: Microelectronics Reliability. 139.2022, December, 9 S., 114799.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Elektronische Veröffentlichung vor Drucklegung.
Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics
Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 Mai 2022, (Elektronische Veröffentlichung vor Drucklegung.) in: Microelectronics Reliability. 133.2022, June, 9 S., 114537.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK)
Orthaber, M. & Antretter, T., 2022, in: International Journal of Emerging Technologies in Learning. 17.2022, 23, S. 4-6 3 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

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Forschungsportal

Publikationen

Residual Stress Evolution in Low-Alloyed Steel at Three Different Length Scales

On the road towards understanding squats: residual stress state of rails

Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens

Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK): The Best Contributions of 2022’s STACK Community Meeting at the Montanuniversitaet Leoben, Austria

Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK)

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