Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

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Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. / Yalagach, Mahesh; Filipp Fuchs, Peter; Wolfberger, Archim et al.
Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, 2019. S. 2029-2035 8811123 (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Yalagach, M, Filipp Fuchs, P, Wolfberger, A, Gschwandl, M, Antretter, T, Feuchter, M, Tak, C & Tao, Q 2019, Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. in Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019., 8811123, 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Institute of Electrical and Electronics Engineers, S. 2029-2035, 69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, USA / Vereinigte Staaten, 28/05/19. https://doi.org/10.1109/ECTC.2019.00311

APA

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C., & Tao, Q. (2019). Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (S. 2029-2035). Artikel 8811123 (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2019.00311

Vancouver

Yalagach M, Filipp Fuchs P, Wolfberger A, Gschwandl M, Antretter T, Feuchter M et al. Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. in Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers. 2019. S. 2029-2035. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)). doi: 10.1109/ECTC.2019.00311

Author

Yalagach, Mahesh ; Filipp Fuchs, Peter ; Wolfberger, Archim et al. / Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, 2019. S. 2029-2035 (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Bibtex - Download

@inproceedings{89593b5715d242df8bf99220287d5bc1,
title = "Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads",
keywords = "deformation, hygro-mechanical characterization, hygro-thermal, hygro-thermo-mechanical simulation, hygroscopic swelling, solubility",
author = "Mahesh Yalagach and {Filipp Fuchs}, Peter and Archim Wolfberger and Mario Gschwandl and Thomas Antretter and Michael Feuchter and Coen Tak and Qi Tao",
year = "2019",
month = may,
day = "1",
doi = "10.1109/ECTC.2019.00311",
language = "English",
isbn = "9781728114989",
series = "2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)",
publisher = "Institute of Electrical and Electronics Engineers",
pages = "2029--2035",
booktitle = "Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019",
address = "United States",
note = "69th IEEE Electronic Components and Technology Conference, ECTC 2019 ; Conference date: 28-05-2019 Through 31-05-2019",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

AU - Yalagach, Mahesh

AU - Filipp Fuchs, Peter

AU - Wolfberger, Archim

AU - Gschwandl, Mario

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Tak, Coen

AU - Tao, Qi

PY - 2019/5/1

Y1 - 2019/5/1

KW - deformation

KW - hygro-mechanical characterization

KW - hygro-thermal

KW - hygro-thermo-mechanical simulation

KW - hygroscopic swelling

KW - solubility

UR - https://pure.unileoben.ac.at/portal/en/publications/numerical-analysis-of-the-influence-of-polymeric-materials-on-a-mems-package-performance-under-humidity-and-temperature-loads(89593b57-15d2-42df-8bf9-9220287d5bc1).html

U2 - 10.1109/ECTC.2019.00311

DO - 10.1109/ECTC.2019.00311

M3 - Conference contribution

AN - SCOPUS:85072299869

SN - 9781728114989

T3 - 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

SP - 2029

EP - 2035

BT - Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019

PB - Institute of Electrical and Electronics Engineers

T2 - 69th IEEE Electronic Components and Technology Conference, ECTC 2019

Y2 - 28 May 2019 through 31 May 2019

ER -

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