Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Publikationen: Konferenzbeitrag › Poster › Forschung › (peer-reviewed)
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Details
| Titel in Übersetzung | Characterization and modeling of the AuSnCu thin solder joint under thermal cycling |
|---|---|
| Originalsprache | Englisch |
| Status | Veröffentlicht - 2014 |
| Veranstaltung | 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Gent, Belgien Dauer: 7 Apr. 2014 → 9 Apr. 2014 |
Konferenz
| Konferenz | 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
|---|---|
| Kurztitel | EuroSimE 2014 |
| Land/Gebiet | Belgien |
| Ort | Gent |
| Zeitraum | 7/04/14 → 9/04/14 |
