Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces. / Kleinbichler, Andreas; Zechner, J.; Cordill, Megan.
in: Microelectronic engineering, Jahrgang 167.2017, Nr. 5 January, 02.11.2016, S. 63-68.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Bibtex - Download

@article{c50d23c1fc99469086876211a14e65e6,
title = "Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces",
author = "Andreas Kleinbichler and J. Zechner and Megan Cordill",
year = "2016",
month = nov,
day = "2",
language = "English",
volume = "167.2017",
pages = "63--68",
journal = "Microelectronic engineering",
issn = "0167-9317",
publisher = "Elsevier",
number = "5 January",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

AU - Kleinbichler, Andreas

AU - Zechner, J.

AU - Cordill, Megan

PY - 2016/11/2

Y1 - 2016/11/2

M3 - Article

VL - 167.2017

SP - 63

EP - 68

JO - Microelectronic engineering

JF - Microelectronic engineering

SN - 0167-9317

IS - 5 January

ER -