Institute of Electrical and Electronics Engineers

Publisher

Research output

  1. 2021
  2. Published

    A probabilistic approach for complete coverage path planning with low-cost systems

    Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).

    Research output: Chapter in Book/Report/Conference proceedingChapterResearch

  3. Published

    Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.

    Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Jul 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, p. 1148 1 p. (2021 IEEE World Haptics Conference, WHC 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  4. Published

    Effects of artificial ageing tests on EVA degradation: Influence of microclimate and methodology approach

    Barretta, C., Oreski, G., Kyranaki, N., Mansour, D. E., Betts, T. R., Bauermann, L. P. & Resch-Fauster, K., 20 Jun 2021, 2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021. Institute of Electrical and Electronics Engineers, p. 312-315 4 p. (Conference Record of the IEEE Photovoltaic Specialists Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  5. Published

    Development and Hardware-in-the-Loop Simulation of an Air Purifier Automatic Control System

    Babunski, D., Zaev, E., Poposki, F., Koleva, R. & Rath, G., 7 Jun 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Institute of Electrical and Electronics Engineers, 9460141. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  6. Published

    Hardware-in-the-loop for Simulation and Control of Greenhouse Climate

    Zaev, E., Babunski, D., Jovanov, A., Rath, G. & Payr, M. P., 7 Jun 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Budva: Institute of Electrical and Electronics Engineers, 9460206. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published

    Estimating Parameters of a Sine Wave by the Method of Variable Projection

    O'Leary, P. & Ninevski, D., 17 May 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 9459842. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; vol. 2021-May).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published

    Instrumentation of a Roving Inspection Test Rig with Surface Geometry Measurement of Fiber Bundles

    Lehner, S., Neunkirchen, S., Fauster, E. & O'Leary, P., 17 May 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. IEEE Xplore (online): Institute of Electrical and Electronics Engineers, 9459889. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; vol. 2021-May).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  11. Published

    Learning to Drive with Deep Reinforcement Learning

    Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, p. 147-152 6 p. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution