Institute of Electrical and Electronics Engineers

Publisher

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Research output

  1. 2023
  2. Published

    The Influence of Isolation on Learning in an Immersive Laboratory Environment

    Holly, M., Sommer, S., Ruh, T., Stadlbauer, D., Rameshan, C. & Pirker, J., 2023, International Conference on Advanced Learning Technologies (ICALT). Chang, M., Chen, N.-S., Kuo, R., Rudolph, G., Sampson, D. G. & Tlili, A. (eds.). Institute of Electrical and Electronics Engineers, Vol. 2023. p. 285-289 5 p. (2023 IEEE International Conference on Advanced Learning Technologies (ICALT)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

    Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. H∞-Based Double Grid Forming Controller of Multi-Modular Converters in a Hybrid AC/DC Grid

    Eder, B. P., Adolfo, A., Markus, M. & Florian, D., 25 Jun 2023, 2023 IEEE 24th Workshop on Control and Modeling for Power Electronics, COMPEL 2023. Institute of Electrical and Electronics Engineers, (2023 IEEE 24th Workshop on Control and Modeling for Power Electronics, COMPEL 2023).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  5. Published

    Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection

    Handler, J., Ninevski, D. & O'Leary, P., Oct 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. 2024
  7. Published

    A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

    Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

    Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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