Thermal Stresses and Microstructure of Tungsten Films on Copper
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| Translated title of the contribution | Thermal Stresses and Microstructure of Tungsten Films on Copper |
|---|---|
| Original language | English |
| Pages (from-to) | 273-277 |
| Journal | Berg- und hüttenmännische Monatshefte : BHM |
| Volume | 517 |
| Publication status | Published - 2008 |
