Thermal stability of immiscible sputter-deposited Cu-Mo thin films

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Thermal stability of immiscible sputter-deposited Cu-Mo thin films. / Souli, Imane; Gruber, Georg; Terziyska, Velislava et al.
In: Journal of alloys and compounds, Vol. 793.2019, No. April, 30.04.2019, p. 208-218.

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@article{01fb5f99c59b43a489984bbd3fa32154,
title = "Thermal stability of immiscible sputter-deposited Cu-Mo thin films",
abstract = "Thin films within the immiscible binary Cu-Mo system were synthetized by d.c. magnetron sputter co-deposition and studied over the entire composition range. In the as-deposited state, the alloy films present single-phase Cu(Mo) or Mo(Cu) solid solutions for low- or high Mo contents, respectively, or Cu- and Mo-rich dual-phase structures for intermediate Mo contents. Annealing up to temperatures of 500 °C was conducted to study microstructural stability, phase decomposition, stress, hardness, elastic modulus and electrical resistivity. The Cu(Mo) solid solution observed for low Mo contents provides remarkable thermal stability and improves the mechanical properties with a minimized impact on the electrical resistivity up to the investigated annealing temperatures. In contrast, the Cu- and Mo-rich dual-phase structures offer the possibility to benefit from the two constituents' thermo-mechanical properties within the miscibility gap; however, they are characterized by a reduced thermal stability.",
author = "Imane Souli and Georg Gruber and Velislava Terziyska and Johannes Zechner and Christian Mitterer",
year = "2019",
month = apr,
day = "30",
doi = "10.1016/j.jallcom.2018.12.250",
language = "English",
volume = "793.2019",
pages = "208--218",
journal = "Journal of alloys and compounds",
issn = "0925-8388",
publisher = "Elsevier",
number = "April",

}

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TY - JOUR

T1 - Thermal stability of immiscible sputter-deposited Cu-Mo thin films

AU - Souli, Imane

AU - Gruber, Georg

AU - Terziyska, Velislava

AU - Zechner, Johannes

AU - Mitterer, Christian

PY - 2019/4/30

Y1 - 2019/4/30

N2 - Thin films within the immiscible binary Cu-Mo system were synthetized by d.c. magnetron sputter co-deposition and studied over the entire composition range. In the as-deposited state, the alloy films present single-phase Cu(Mo) or Mo(Cu) solid solutions for low- or high Mo contents, respectively, or Cu- and Mo-rich dual-phase structures for intermediate Mo contents. Annealing up to temperatures of 500 °C was conducted to study microstructural stability, phase decomposition, stress, hardness, elastic modulus and electrical resistivity. The Cu(Mo) solid solution observed for low Mo contents provides remarkable thermal stability and improves the mechanical properties with a minimized impact on the electrical resistivity up to the investigated annealing temperatures. In contrast, the Cu- and Mo-rich dual-phase structures offer the possibility to benefit from the two constituents' thermo-mechanical properties within the miscibility gap; however, they are characterized by a reduced thermal stability.

AB - Thin films within the immiscible binary Cu-Mo system were synthetized by d.c. magnetron sputter co-deposition and studied over the entire composition range. In the as-deposited state, the alloy films present single-phase Cu(Mo) or Mo(Cu) solid solutions for low- or high Mo contents, respectively, or Cu- and Mo-rich dual-phase structures for intermediate Mo contents. Annealing up to temperatures of 500 °C was conducted to study microstructural stability, phase decomposition, stress, hardness, elastic modulus and electrical resistivity. The Cu(Mo) solid solution observed for low Mo contents provides remarkable thermal stability and improves the mechanical properties with a minimized impact on the electrical resistivity up to the investigated annealing temperatures. In contrast, the Cu- and Mo-rich dual-phase structures offer the possibility to benefit from the two constituents' thermo-mechanical properties within the miscibility gap; however, they are characterized by a reduced thermal stability.

UR - http://www.scopus.com/inward/record.url?scp=85059342006&partnerID=8YFLogxK

U2 - 10.1016/j.jallcom.2018.12.250

DO - 10.1016/j.jallcom.2018.12.250

M3 - Article

VL - 793.2019

SP - 208

EP - 218

JO - Journal of alloys and compounds

JF - Journal of alloys and compounds

SN - 0925-8388

IS - April

ER -