Thermal stability of immiscible sputter-deposited Cu-Mo thin films
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in: Journal of alloys and compounds, Jahrgang 793.2019, Nr. April, 30.04.2019, S. 208-218.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Thermal stability of immiscible sputter-deposited Cu-Mo thin films
AU - Souli, Imane
AU - Gruber, Georg
AU - Terziyska, Velislava
AU - Zechner, Johannes
AU - Mitterer, Christian
PY - 2019/4/30
Y1 - 2019/4/30
N2 - Thin films within the immiscible binary Cu-Mo system were synthetized by d.c. magnetron sputter co-deposition and studied over the entire composition range. In the as-deposited state, the alloy films present single-phase Cu(Mo) or Mo(Cu) solid solutions for low- or high Mo contents, respectively, or Cu- and Mo-rich dual-phase structures for intermediate Mo contents. Annealing up to temperatures of 500 °C was conducted to study microstructural stability, phase decomposition, stress, hardness, elastic modulus and electrical resistivity. The Cu(Mo) solid solution observed for low Mo contents provides remarkable thermal stability and improves the mechanical properties with a minimized impact on the electrical resistivity up to the investigated annealing temperatures. In contrast, the Cu- and Mo-rich dual-phase structures offer the possibility to benefit from the two constituents' thermo-mechanical properties within the miscibility gap; however, they are characterized by a reduced thermal stability.
AB - Thin films within the immiscible binary Cu-Mo system were synthetized by d.c. magnetron sputter co-deposition and studied over the entire composition range. In the as-deposited state, the alloy films present single-phase Cu(Mo) or Mo(Cu) solid solutions for low- or high Mo contents, respectively, or Cu- and Mo-rich dual-phase structures for intermediate Mo contents. Annealing up to temperatures of 500 °C was conducted to study microstructural stability, phase decomposition, stress, hardness, elastic modulus and electrical resistivity. The Cu(Mo) solid solution observed for low Mo contents provides remarkable thermal stability and improves the mechanical properties with a minimized impact on the electrical resistivity up to the investigated annealing temperatures. In contrast, the Cu- and Mo-rich dual-phase structures offer the possibility to benefit from the two constituents' thermo-mechanical properties within the miscibility gap; however, they are characterized by a reduced thermal stability.
UR - http://www.scopus.com/inward/record.url?scp=85059342006&partnerID=8YFLogxK
U2 - 10.1016/j.jallcom.2018.12.250
DO - 10.1016/j.jallcom.2018.12.250
M3 - Article
VL - 793.2019
SP - 208
EP - 218
JO - Journal of alloys and compounds
JF - Journal of alloys and compounds
SN - 0925-8388
IS - April
ER -