TY - JOUR

T1 - Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching

AU - Rafailović, Lidija D.

AU - Trišović, Tomislav

AU - Stupavská, Monika

AU - Souček, Pavel

AU - Velicsanyi, Peter

AU - Nixon, Sonja

AU - Elbataioui, Adam

AU - Zak, Stanislav

AU - Cordill, Megan J.

AU - Hohenwarter, Anton

AU - Kleber, Christoph

AU - Ráheľ, Jozef

N1 - Publisher Copyright: © 2024 The Authors

PY - 2024/4/20

Y1 - 2024/4/20

N2 - We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal.

AB - We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal.

KW - Air plasma etching

KW - Composite materials

KW - Cu microstructure

KW - In-situ SEM impedance

KW - Nanofabrications

KW - Selective metallization

UR - http://www.scopus.com/inward/record.url?scp=85191612894&partnerID=8YFLogxK

U2 - 10.1016/j.jallcom.2024.174569

DO - 10.1016/j.jallcom.2024.174569

M3 - Article

AN - SCOPUS:85191612894

VL - 992.2024

JO - Journal of alloys and compounds

JF - Journal of alloys and compounds

SN - 0925-8388

IS - 15 July

M1 - 174569

ER -