Research output

  1. 2021
  2. The notion of almost zeros and randomness

    Poulios, N., Leventides, J. & Karcanias, N., 22 Apr 2021, In: IMA Journal of Mathematical Control and Information. 39.2021, 2, p. 460-475 16 p.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    A universal criterion for the failure threshold in slowly sheared bulk metallic glasses

    Luo, Y. S., Wang, Z., Eckert, J. & Qiao, J. W., 21 Apr 2021, In: Journal of applied physics. 129, 15, 155109.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Blast vibration reduction

    Trabi, B., Bleibinhaus, F. & Tauchner, C., 21 Apr 2021.

    Research output: Contribution to conferencePosterResearch

  5. Published
  6. Published

    Nanoindentation in multi-modal map combinations: a correlative approach to local mechanical property assessment

    Magazzeni, C., Garner, H., Howe, I., Gopon, P., Waite, J., Rugg, D., Armstrong, D. & Wilkinson, A., 21 Apr 2021, In: Journal of Materials Research. 36

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Preparation and characterization of La0.8Ca0.2Fe0.8Co0.2O3-δ as a new air electrode material for solid oxide cells

    Micu-Budisteanu, M., Berger, C., Bucher, E., Lenser, C., Menzler, N. H. & Sitte, W., 20 Apr 2021.

    Research output: Contribution to conferencePosterResearch

  8. Published

    Theoretical and experimental investigations of mechanical vibrations of hot hammer forging

    Saberi, S., Fischer, J., Stockinger, M., Tikal, R. & Afsharnia, R., 20 Apr 2021, In: International Journal of Advanced Manufacturing Technology. 114.2021, 9-10, p. 3037-3045 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published
  11. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution