Research output

  1. 2023
  2. Published
  3. Published

    The micromechanical characterization of silicon up to 950 °C

    Schaffar, G. J. K., Tscharnuter, D. & Maier-Kiener, V., 2023.

    Research output: Contribution to conferencePosterResearch

  4. Published
  5. Published
  6. Published
  7. Published
  8. Published
  9. Published
  10. Published

    Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

    Thalhamer, A., Rossegger, E., Hasil, S., Hrbinič, K., Feigl, V., Pfost, M. & Fuchs, P. F., 2023.

    Research output: Contribution to conferencePosterResearch

  11. Published

    Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

    Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution