Research output

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2016
E-pub ahead of print
Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
Kleinbichler, A., Zechner, J. & Cordill, M., 2 Nov 2016, (E-pub ahead of print) In: Microelectronic engineering. 167.2017, 5 January, p. 63-68 6 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
Grain growth during cyclic straining of copper film revealed with in-situ resistance measurements
Cordill, M. & Glushko, O., 25 Oct 2016.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
Evaluating reliability of flexible electronic materials with combined electromechanical testing techniques
Cordill, M., 25 May 2016.
Research output: Contribution to conference › Presentation › Research › peer-review
Published
Examining nanoindentation imprints with in-situ AFM-SEM
Cordill, M., Kreith, J., Strunz, T. & Fantner, E. J., 30 Mar 2016.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis
Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 22 Mar 2016.
Research output: Contribution to conference › Presentation › Research
Published
33-2: Invited Paper: Evaluating Reliability of Flexible Electronic Materials with Combined Electro-Mechanical Testing Techniques
Cordill, M., Berger, J. & Jörg, T., 2016, Digest of technical papers / Society for Information Display, SID. (Digest of technical papers / Society for Information Display, SID).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Published
Advanced Characterization of thermo-mechanical fatigue mechanisms for semiconductor metallizations
Bigl, S., Wurster, S., Schöberl, T., Cordill, M. & Kiener, D., 2016.
Research output: Contribution to conference › Presentation › Research › peer-review
Published
Cyclic electo-mechanical behavior of ductile films strained with in-situ methods
Cordill, M., Glushko, O. & Putz, B., 2016.
Research output: Contribution to conference › Presentation › Research
Published
Cyclic electro-mechanical behavior of ductile films strained with in-situ methods
Cordill, M. & Glushko, O., 2016.
Research output: Contribution to conference › Presentation › Research › peer-review

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Research Portal

Research output

Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

Grain growth during cyclic straining of copper film revealed with in-situ resistance measurements

Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

Evaluating reliability of flexible electronic materials with combined electromechanical testing techniques

Examining nanoindentation imprints with in-situ AFM-SEM

Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis

33-2: Invited Paper: Evaluating Reliability of Flexible Electronic Materials with Combined Electro-Mechanical Testing Techniques

Advanced Characterization of thermo-mechanical fatigue mechanisms for semiconductor metallizations

Cyclic electo-mechanical behavior of ductile films strained with in-situ methods

Cyclic electro-mechanical behavior of ductile films strained with in-situ methods

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