Research output

  1. 2016
  2. Published

    Mechanical stability of printed metallizations on polymer substrates

    Glushko, O., Cordill, M., Klug, A. & List-Kratochvil, E. J. W., 2016.

    Research output: Contribution to conferencePresentationResearchpeer-review

  3. Published
  4. Published

    Sputter-deposited Mo thin films with improved fracture behaviorfor flexible electronics

    Jörg, T., Cordill, M. J., Franz, R., Glushko, O., Winkler, J. & Mitterer, C., 2016.

    Research output: Contribution to conferencePresentationResearch

  5. Published

    The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates

    Glushko, O., Cordill, M., Klug, A. & List-Kratochvil, E. J. W., 2016, In: Microelectronics Reliability.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    The electro-mechanical behavior of sputter- deposited Mo thin films on flexible substrates

    Jörg, T., Cordill, M., Franz, R., Glushko, O., Winkler, J. & Mitterer, C., 2016, In: Thin solid films. 606, p. 45-50 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Thermo-physical properties of selected hard rocks and their relation to microwave-assisted comminution

    Hartlieb, P., Toifl, M., Kuchar, F., Meisels, R. & Antretter, T., 2016, In: Minerals engineering. 91.2016, p. 34 - 41 8 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. 2015
  9. Published

    The relation of temperature, microwave absorbing properties and thermo - dynamic behavior of selected hard rocks

    Hartlieb, P., Toifl, M., Meisels, R., Antretter, T. & Kuchar, F., 11 Jun 2015, Physical Separation 15 - Proceedings.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published
  11. Published

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  12. Published
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