Gschwandl, M.,
Pfost, M.,
Antretter, T.,
Fuchs, P. F.,
Mitev, I.,
Tao, Q. &
Schingale, A.,
19 Apr 2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution