Peng, C.,
Morak, M.,
Thalhamer, A.,
Gschwandl, M.,
Fuchs, P.,
Tao, Q.,
Krivec, T.,
Antretter, T. &
Celigueta, M. A.,
2022,
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution