Research output

  1. 2023
  2. Published
  3. Published

    Templated grain growth in rapid sintered 3D-printed alumina ceramics

    Hofer, A-K., Kocjan, A. & Bermejo Moratinos, R., 2023, In: Open ceramics. 15, 100428.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    The effect of liquid phase chemistry on the densification and strength of cold sintered ZnO

    Jabr, A., Fanghanel, J., Zongming, F., Bermejo, R. & Randall, C. A., 2023, In: Journal of the European Ceramic Society. 43.2023, 4, p. 1531-1541 11 p.

    Research output: Contribution to journalArticleResearchpeer-review

  5. 2022
  6. Published
  7. Published

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Strategies to enhance structural properties of 3D-printed ceramics

    Hofer, A-K., Schlacher, J. C., Schwentenwein, M. & Bermejo Moratinos, R., 16 Jun 2022.

    Research output: Contribution to conferencePosterResearch

  9. E-pub ahead of print

    Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

    Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 May 2022, (E-pub ahead of print) In: Microelectronics Reliability. 133.2022, June, 9 p., 114537.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Contact damage tolerance of alumina-based layered ceramics with tailored microstructures

    Schlacher, J., Jabr, A., Hofer, A. & Bermejo, R., 4 Apr 2022, In: Journal of the American Ceramic Society. p. 4387-4399

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published
  12. Published

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

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