Research output

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  1. 2015
  2. Published

    The relation of temperature, microwave absorbing properties and thermo - dynamic behavior of selected hard rocks

    Hartlieb, P., Toifl, M., Meisels, R., Antretter, T. & Kuchar, F., 11 Jun 2015, Physical Separation 15 - Proceedings.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    The relation of temperature, microwave absorbing properties and thermo-dynamic properties of selected hard rocks

    Hartlieb, P., Toifl, M., Meisels, R., Antretter, T. & Kuchar, F., 11 Jun 2015.

    Research output: Contribution to conference › Presentation › Research

  4. Published

    NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY

    Mikl-Resch, M. J., Tichy, R., Antretter, T., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 13 May 2015. 5 p.

    Research output: Contribution to conference › Presentation › Research › peer-review

  5. Published

    NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY

    Mikl-Resch, M. J., Antretter, T., Tichy, R., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 10 May 2015. 5 p.

    Research output: Contribution to conference › Poster › Research

  6. Published

    NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY

    Mikl-Resch, M. J., Antretter, T., Tichy, R., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 10 May 2015, ISRM 2015_PROCEEDINGS. 5 p. 724

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Heat development at the microscale in ceramic components - thermography and complementary tools

    Röhrig, S., Petschenig, I., Bermejo, R., Hofstätter, M., Aldrian, F., Danzer, R. & Supancic, P., 1 Apr 2015

    Research output: Other contribution › Research

  10. Published

    Mechanical characterization of miniaturized functional substrates and components in different environments

    Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 1 Apr 2015

    Research output: Other contribution › Research

  11. Published

    3D numerical study on microwave induced stresses in inhomogeneous hard rocks

    Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2015.

    Research output: Contribution to conference › Paper

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