Research output

281 - 290 out of 549Page size: 10
rss feed
  1. 2015
  2. Published

    NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY

    Mikl-Resch, M. J., Antretter, T., Tichy, R., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 10 May 2015, ISRM 2015_PROCEEDINGS. 5 p. 724

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    Microstructure and mechanical properties of CuxNb1- x alloys prepared by ball milling and high pressure torsion compacting

    Abad, M. D., Parker, S., Kiener, D., Primorac, M. M. & Hosemann, P., 5 May 2015, In: Journal of alloys and compounds. 630, p. 117-125 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr 2015, In: Scripta materialia. 100, p. 94-97 4 p.

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Influence of Microstructure on the Deformation Behaviour of Chromium

    Fritz, R., Wimler, D., Krautgasser, C., Leitner, A., Maier, V. & Kiener, D., 9 Apr 2015.

    Research output: Contribution to conference › Poster › Research

  7. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Thermally activated deformation processes in body-centered cubic Cr - How microstructure influences strain-rate sensitivity

    Maier, V., Hohenwarter, A., Pippan, R. & Kiener, D., 31 Mar 2015, In: Scripta materialia. 106, p. 42-45 4 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Site Specific Microstructural Evolution of Thermo-mechanically Fatigued Copper Films

    Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 18 Feb 2015, In: Berg- und hüttenmännische Monatshefte : BHM. 160, 5, p. 235-239 5 p.

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    Small scale mechanical testing of irradiated materials

    Hosemann, P., Shin, C. & Kiener, D., 27 Jan 2015, In: Journal of materials research (JMR). 30, 9, p. 1231-1245 15 p.

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Electron Backscatter Diffraction – How to read this information on polycrystalline films

    Wurster, S., Bigl, S., Renk, O., Gludovatz, B., Hohenwarter, A., Motz, C., Kiener, D. & Pippan, R., 22 Jan 2015.

    Research output: Contribution to conference › Presentation › Research

Previous 1...25 26 27 28 29 30 31 32 ...55 Next

Advanced filters

All authors

Reset

to
Reset filters