Research output

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  1. 2021
  2. Published

    Ductile failure modelling in pre-cracked solids using coupled fracture locus theory

    Baltic, S., Magnien, J., Kolitsch, S., Gänser, H-P., Antretter, T. & Hammer, R., Jul 2021, In: Engineering Fracture Mechanics. 252.2021, July, 13 p., 107845.

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    MUL 4.0 – Digitalisierung der Wertschöpfungskette vom Rohmaterial bis hin zum Recycling

    Woschank, M., Ralph, B. J., Kaiblinger, A., Miklautsch, P., Pacher, C., Sorger, M., Zsifkovits, H., Stockinger, M., Pogatscher, S., Antretter, T. & Antrekowitsch, H., 2 Jun 2021, In: Berg- und hüttenmännische Monatshefte : BHM. 166, 6, p. 309-313

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conference › Paper › peer-review

  5. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Role of elastic strain energy in spheroidal precipitates revisited

    Böhm, H. J., Zickler, G., Fischer, F-D. & Svoboda, J., Apr 2021, In: Mechanics of materials. 155, April, 6 p., 103781.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations

    Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

    Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  11. 2020
  12. Published

    Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

    Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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