Research output

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  1. 2021
  2. Published

    Sucker Rod Antibuckling System: Development and Field Application

    Langbauer, C., Fruhwirth, R. & Volker, L. J., May 2021, In: SPE production & operations. 36.2021, 2, p. 327-342 16 p.

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  5. Published

    Downhole Dynamometer Sensors for Sucker Rod Pumps

    Langbauer, C., Diengsleder-Lambauer, K. & Lieschnegg, M., 15 Mar 2021, In: IEEE sensors journal. 21.2021, 6, p. 8543-8552 10 p., 9294024.

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Hydraulic Concentric Tubular Pumping System Simulation and Testing

    Langbauer, C., Vita, P., Jax, G. & Judmaier, D., 8 Feb 2021, In: Journal of petroleum & environmental biotechnology . 11.2021, 5, 15 p.

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations

    Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

    Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    GeoEnergy Engineering: Production Optimizations and Improvements

    Langbauer, C., 2021

    Research output: Thesis › Habilitation thesis › peer-review

  10. 2020
  11. Published

    Artificial Lift Selection and Testing for an Enhanced Oil Recovery Redevelopment Project-Lessons Learned: From Laboratory Results and Pump Test Facility Experiments to Field Pilots

    Hoy, M. G., Langbauer, C., Knauhs, P., Pratscher, H-P., Cimitoglu, T., Marschall, C., Puls, C. & Hurch, S., 15 Dec 2020.

    Research output: Contribution to conference › Paper › peer-review

  12. Published

    Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

    Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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