Research output

  1. 2015
  2. Published

    NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY

    Mikl-Resch, M. J., Tichy, R., Antretter, T., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 13 May 2015. 5 p.

    Research output: Contribution to conferencePresentationResearchpeer-review

  3. Published

    NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY

    Mikl-Resch, M. J., Antretter, T., Tichy, R., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 10 May 2015. 5 p.

    Research output: Contribution to conferencePosterResearch

  4. Published

    NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY

    Mikl-Resch, M. J., Antretter, T., Tichy, R., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 10 May 2015, ISRM 2015_PROCEEDINGS. 5 p. 724

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  5. Published

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  6. E-pub ahead of print

    An approximate Riemann solver for shallow water equations and heat advection in horizontal centrifugal casting

    Bohacek, J., Kharicha, A., Ludwig, A. & Wu, M., 30 Apr 2015, (E-pub ahead of print) In: Journal of computational and applied mathematics. 267.2015, 15 September, p. 179-194 16 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Experimental and numerical analysis of free surface deformation in an electrically driven flow

    Kharicha, A., Teplyakov, I., Ivochkin, Y., Wu, M., Ludwig, A. & Guseva, A., 1 Apr 2015, In: Experimental Thermal and Fluid Science. 62, p. 192-201 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published
  10. Published

    Mechanical characterization of miniaturized functional substrates and components in different environments

    Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 1 Apr 2015

    Research output: Other contributionResearch

  11. Published