Research output

  1. 2021
  2. Published

    EURECA-PRO, The European University Alliance on Responsible Consumption and Production

    Moser, P., Feiel, S., Barbknecht, K-D., Diamadopoulos, E., Mężyk, A., Baelo, R., Radu, S. M., Hilmer, L. & Komnitsas, K., 30 Jun 2021, Proceedings of the European Metallurgical Conference 2021. 1 ed. Clausthal, Vol. 1. p. 1-15 15 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  3. Published
  4. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conferencePaperpeer-review

  5. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published
  8. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Blastability and Ore Grade Assessment from Drill Monitoring for Open Pit Applications

    Navarro, J., Seidl, T., Hartlieb, P., Sanchidrián, J. A., Segarra, P., Couceiro, P., Schimek, P. & Godoy, C., 17 Apr 2021, In: Rock mechanics and rock engineering. 54.2021, June, p. 3209-3228 20 p.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations

    Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

    Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

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