Research output

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  1. 2023
  2. Published

    Experimental and Numerical Visualisation of Subsurface Rail Deformation in a Full-Scale Wheel–Rail Test Rig

    Gschwandl, T. J., Weniger, T. M., Antretter, T., Künstner, D., Scheriau, S. & Daves, W., Jun 2023, In: Metals. 13.2023, 6, 18 p., 1089.

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    Residual Stress Evolution in Low-Alloyed Steel at Three Different Length Scales

    Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 23 Mar 2023, In: Materials. 16.2023, 7, 17 p., 2568.

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    On the road towards understanding squats: residual stress state of rails

    Gschwandl, T. J., Daves, W., Antretter, T., Bucher, C. & Künstner, D., 2023, In: Procedia Structural Integrity. 46, p. 17-23 7 p.

    Research output: Contribution to journal › Conference article › peer-review

  5. Published

    Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens

    Prabitz, K., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R., Polcik, P. & Ecker, W., 2023, XLI. Verformungskundliches Kolloquium.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides

    Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.

    Research output: Contribution to conference › Poster › Research

  7. 2022
  8. Published

    A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK): The Best Contributions of 2022’s STACK Community Meeting at the Montanuniversitaet Leoben, Austria

    Orthaber, M. (Guest ed.), Antretter, T. (Guest ed.), Orthaber, M. & Antretter, T., 8 Dec 2022, In: International journal emerging technologies in learning : iJET. 2022, Vol. 17 No. 23

    Research output: Contribution to journal › Special issue › Research › peer-review

  9. Published

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.

    Research output: Contribution to journal › Article › Research › peer-review

  10. E-pub ahead of print

    Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

    Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 May 2022, (E-pub ahead of print) In: Microelectronics Reliability. 133.2022, June, 9 p., 114537.

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK)

    Orthaber, M. & Antretter, T., 2022, In: International Journal of Emerging Technologies in Learning. 17.2022, 23, p. 4-6 3 p.

    Research output: Contribution to journal › Article › Research › peer-review

  12. Published

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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