Research output

  1. 2023
  2. Published

    On the road towards understanding squats: residual stress state of rails

    Gschwandl, T. J., Daves, W., Antretter, T., Bucher, C. & Künstner, D., 2023, In: Procedia Structural Integrity. 46, p. 17-23 7 p.

    Research output: Contribution to journalConference articlepeer-review

  3. Published

    Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens

    Prabitz, K., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R., Polcik, P. & Ecker, W., 2023, XLI. Verformungskundliches Kolloquium.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  4. Published
  5. 2022
  6. Published
  7. Published

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.

    Research output: Contribution to journalArticleResearchpeer-review

  8. E-pub ahead of print

    Residual stress distribution of a locally and inductively quenched and tempered 50CrMo4 steel analysed by synchrotron transmission techniques

    Jászfi, V., Prevedel, P., Raninger, P., Todt, J., Mevec, D., Godai, Y., Maawad, E. & Ebner, R., 16 Jul 2022, (E-pub ahead of print) In: Materials & design. 221.2022, September, 9 p., 110936.

    Research output: Contribution to journalArticleResearchpeer-review

  9. E-pub ahead of print

    Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

    Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 May 2022, (E-pub ahead of print) In: Microelectronics Reliability. 133.2022, June, 9 p., 114537.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published
  11. Published

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  12. 2021
  13. Published

    Liquid Metal Embrittlement of Advanced High Strength Steel: Experiments and damage modeling

    Prabitz, K., Asadzadeh, M. Z., Pichler, M., Antretter, T., Beal, C., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R. & Ecker, W., 21 Sept 2021, In: Materials. 14.2021, 18, 15 p., 5451.

    Research output: Contribution to journalArticleResearchpeer-review

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