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2021
E-pub ahead of print
Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers
Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 9 Jan 2021, (E-pub ahead of print) In: Thin solid films. 720.2021, 28 February, 9 p., 138533.
Research output: Contribution to journal › Article › Research › peer-review
Published
Effect of Pt nanoparticle decoration on the H2 storage performance of plasma-derived nanoporous graphene
Kostoglou, N., Liao, C-W., Wang, C-Y., Kondo, J. N., Tampaxis, C., Steriotis, T., Giannakopoulos, K., Kontos, A. G., Hinder, S. J., Baker, M., Bousser, E., Matthews, A., Rebholz, C. & Mitterer, C., Jan 2021, In: Carbon. 171, 171, p. 294-305 12 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
The effect of grain size on bubble formation and evolution in helium-irradiated Cu-Fe-Ag
Wurmshuber, M., Frazer, D., Balooch, M., Issa, I., Bachmaier, A., Hosemann, P. & Kiener, D., Jan 2021, In: Materials characterization. 171, 171, 110822.
Research output: Contribution to journal › Article › Research › peer-review
Published
Advanced in situ electrochemical nanoindentation testing for understanding hydrogen-materials interactions
Ebner, A., Clemens, H., Pippan, R. & Maier-Kiener, V., 2021.
Research output: Contribution to conference › Poster › Research
Published
Evolution of structure, residual stress, thermal stability and wear resistance of nanocrystalline multilayered Al0.7Cr0.3N-Al0.67Ti0.33N coatings
Spor, S., Jäger, N., Meindlhumer, M., Hruby, H., Burghammer, M., Nahif, F., Mitterer, C., Keckes, J. & Daniel, R., 2021, In: Surface & coatings technology. 425.2021, 15 November, 9 p., 127712.
Research output: Contribution to journal › Article › Research › peer-review
Published
How grain boundary characteristics influence plasticity close to and above the critical temperature of ultra-fine grained bcc Ta2.5W
Kappacher, J., Renk, O., Kiener, D., Clemens, H. & Maier-Kiener, V., 2021, In: Acta materialia. 2021, 216, 11 p., 117110.
Research output: Contribution to journal › Article › Research › peer-review
Published
Interfacial damage of TiN coated high speed steels under a realistic spectrum of shear- and normal loads
Gsellmann, M., 2021
Research output: Thesis › Doctoral Thesis
Published
Stable and metastable phases in Cu20Sn investigated via high resolution methods
Lumper, L., Kappacher, J., Clemens, H. & Maier-Kiener, V., 2021.
Research output: Contribution to conference › Poster › Research
2020
Published
Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
Lassnig, A., Terziyska, V. L., Zalesak, J., Jörg, T., Toebbens, D. M., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M. J., 28 Dec 2020, In: ACS Applied Nano Materials. 4.2021, 1, p. 61-70 10 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
Initiation of fatigue damage in ultrafine grained metal films
Glushko, O. & Kiener, D., 27 Dec 2020, In: Acta Materialia. 2021, 206, 10 p., 116599.
Research output: Contribution to journal › Article › Research › peer-review

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Research Portal

Research output

Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers

Effect of Pt nanoparticle decoration on the H2 storage performance of plasma-derived nanoporous graphene

The effect of grain size on bubble formation and evolution in helium-irradiated Cu-Fe-Ag

Advanced in situ electrochemical nanoindentation testing for understanding hydrogen-materials interactions

Evolution of structure, residual stress, thermal stability and wear resistance of nanocrystalline multilayered Al0.7Cr0.3N-Al0.67Ti0.33N coatings

How grain boundary characteristics influence plasticity close to and above the critical temperature of ultra-fine grained bcc Ta2.5W

Interfacial damage of TiN coated high speed steels under a realistic spectrum of shear- and normal loads

Stable and metastable phases in Cu20Sn investigated via high resolution methods

Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Initiation of fatigue damage in ultrafine grained metal films

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