Restrictions of wafer curvature stress measurements by thermally induced plastic substrate deformation
Research output: Contribution to conference › Presentation › Research › peer-review
Standard
Restrictions of wafer curvature stress measurements by thermally induced plastic substrate deformation. / Saringer, Christian; Tkadletz, Michael; Mitterer, Christian.
2015. E-MRS Spring Meeting 2015, Lille, France.
2015. E-MRS Spring Meeting 2015, Lille, France.
Research output: Contribution to conference › Presentation › Research › peer-review
Harvard
Saringer, C, Tkadletz, M & Mitterer, C 2015, 'Restrictions of wafer curvature stress measurements by thermally induced plastic substrate deformation', E-MRS Spring Meeting 2015, Lille, France, 11/05/15 - 15/05/15.
APA
Saringer, C., Tkadletz, M., & Mitterer, C. (2015). Restrictions of wafer curvature stress measurements by thermally induced plastic substrate deformation. E-MRS Spring Meeting 2015, Lille, France.
Vancouver
Saringer C, Tkadletz M, Mitterer C. Restrictions of wafer curvature stress measurements by thermally induced plastic substrate deformation. 2015. E-MRS Spring Meeting 2015, Lille, France.
Author
Bibtex - Download
@conference{cfbda582b36a4046ad41090f8c252200,
title = "Restrictions of wafer curvature stress measurements by thermally induced plastic substrate deformation",
author = "Christian Saringer and Michael Tkadletz and Christian Mitterer",
year = "2015",
language = "English",
note = "E-MRS Spring Meeting 2015 ; Conference date: 11-05-2015 Through 15-05-2015",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - Restrictions of wafer curvature stress measurements by thermally induced plastic substrate deformation
AU - Saringer, Christian
AU - Tkadletz, Michael
AU - Mitterer, Christian
PY - 2015
Y1 - 2015
M3 - Presentation
T2 - E-MRS Spring Meeting 2015
Y2 - 11 May 2015 through 15 May 2015
ER -
