PCB drop test lifetime assessment based on simulations and cyclic bend tests
Research output: Contribution to journal › Article › Research › peer-review
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PCB drop test lifetime assessment based on simulations and cyclic bend tests. / Fuchs, Peter; Pinter, Gerald; Major, Zoltan.
In: Microelectronics Reliability, Vol. 53, 2013, p. 774-781.
In: Microelectronics Reliability, Vol. 53, 2013, p. 774-781.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Fuchs, P, Pinter, G & Major, Z 2013, 'PCB drop test lifetime assessment based on simulations and cyclic bend tests', Microelectronics Reliability, vol. 53, pp. 774-781.
APA
Fuchs, P., Pinter, G., & Major, Z. (2013). PCB drop test lifetime assessment based on simulations and cyclic bend tests. Microelectronics Reliability, 53, 774-781.
Vancouver
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Bibtex - Download
@article{e01fdb19d9c041b5910b84cd4cab2b0d,
title = "PCB drop test lifetime assessment based on simulations and cyclic bend tests",
author = "Peter Fuchs and Gerald Pinter and Zoltan Major",
year = "2013",
language = "English",
volume = "53",
pages = "774--781",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - PCB drop test lifetime assessment based on simulations and cyclic bend tests
AU - Fuchs, Peter
AU - Pinter, Gerald
AU - Major, Zoltan
PY - 2013
Y1 - 2013
M3 - Article
VL - 53
SP - 774
EP - 781
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
ER -
