PCB drop test lifetime assessment based on simulations and cyclic bend tests
Research output: Contribution to journal › Article › Research › peer-review
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| Translated title of the contribution | PCB drop test lifetime assessment based on simulations and cyclic bend tests |
|---|---|
| Original language | English |
| Pages (from-to) | 774-781 |
| Journal | Microelectronics Reliability |
| Volume | 53 |
| Publication status | Published - 2013 |
