Optimum Chip-Tape Adhesion for Reliable Pickup Process

Research output: Contribution to journal › Article › Research › peer-review

Standard

Optimum Chip-Tape Adhesion for Reliable Pickup Process. / Omazic, Marko; Tscharnuter, Daniel; Oreski, Gernot et al.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7.2017, No. 12, 19.09.2017, p. 2057-2065.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Omazic, M, Tscharnuter, D, Oreski, G, Pinczolits, M, Nikac, N, Rappmund, A, Erceg, M & Pinter, G 2017, 'Optimum Chip-Tape Adhesion for Reliable Pickup Process', IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7.2017, no. 12, pp. 2057-2065. https://doi.org/10.1109/TCPMT.2017.2744603

APA

Omazic, M., Tscharnuter, D., Oreski, G., Pinczolits, M., Nikac, N., Rappmund, A., Erceg, M., & Pinter, G. (2017). Optimum Chip-Tape Adhesion for Reliable Pickup Process. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7.2017(12), 2057-2065. https://doi.org/10.1109/TCPMT.2017.2744603

Vancouver

Omazic M, Tscharnuter D, Oreski G, Pinczolits M, Nikac N, Rappmund A et al. Optimum Chip-Tape Adhesion for Reliable Pickup Process. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2017 Sept 19;7.2017(12):2057-2065. doi: 10.1109/TCPMT.2017.2744603

Author

Omazic, Marko ; Tscharnuter, Daniel ; Oreski, Gernot et al. / Optimum Chip-Tape Adhesion for Reliable Pickup Process. In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2017 ; Vol. 7.2017, No. 12. pp. 2057-2065.

Bibtex - Download

@article{ba24281f1f1f4823a60889db0c56267b,
title = "Optimum Chip-Tape Adhesion for Reliable Pickup Process",
keywords = "Accumulated chip stress, adhesive energy, Adhesives, dicing tape, Integrated circuits, pickup process, Polymers, Radiation effects, Silicon, Stress, Substrates, UV-irradiation process.",
author = "Marko Omazic and Daniel Tscharnuter and Gernot Oreski and Michael Pinczolits and Nika Nikac and Andreas Rappmund and Matko Erceg and Gerald Pinter",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/TCPMT.2017.2744603",
language = "English",
volume = "7.2017",
pages = "2057--2065",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
publisher = "Institute of Electrical and Electronics Engineers",
number = "12",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Optimum Chip-Tape Adhesion for Reliable Pickup Process

AU - Omazic, Marko

AU - Tscharnuter, Daniel

AU - Oreski, Gernot

AU - Pinczolits, Michael

AU - Nikac, Nika

AU - Rappmund, Andreas

AU - Erceg, Matko

AU - Pinter, Gerald

PY - 2017/9/19

Y1 - 2017/9/19

KW - Accumulated chip stress

KW - adhesive energy

KW - Adhesives

KW - dicing tape

KW - Integrated circuits

KW - pickup process

KW - Polymers

KW - Radiation effects

KW - Silicon

KW - Stress

KW - Substrates

KW - UV-irradiation process.

UR - http://www.scopus.com/inward/record.url?scp=85030636390&partnerID=8YFLogxK

U2 - 10.1109/TCPMT.2017.2744603

DO - 10.1109/TCPMT.2017.2744603

M3 - Article

AN - SCOPUS:85030636390

VL - 7.2017

SP - 2057

EP - 2065

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

SN - 2156-3950

IS - 12

ER -

View graph of relations

SFX

Publication SFX

By the same authors

View more