Optimum Chip-Tape Adhesion for Reliable Pickup Process
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in: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jahrgang 7.2017, Nr. 12, 19.09.2017, S. 2057-2065.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Optimum Chip-Tape Adhesion for Reliable Pickup Process
AU - Omazic, Marko
AU - Tscharnuter, Daniel
AU - Oreski, Gernot
AU - Pinczolits, Michael
AU - Nikac, Nika
AU - Rappmund, Andreas
AU - Erceg, Matko
AU - Pinter, Gerald
PY - 2017/9/19
Y1 - 2017/9/19
KW - Accumulated chip stress
KW - adhesive energy
KW - Adhesives
KW - dicing tape
KW - Integrated circuits
KW - pickup process
KW - Polymers
KW - Radiation effects
KW - Silicon
KW - Stress
KW - Substrates
KW - UV-irradiation process.
UR - http://www.scopus.com/inward/record.url?scp=85030636390&partnerID=8YFLogxK
U2 - 10.1109/TCPMT.2017.2744603
DO - 10.1109/TCPMT.2017.2744603
M3 - Article
AN - SCOPUS:85030636390
VL - 7.2017
SP - 2057
EP - 2065
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
SN - 2156-3950
IS - 12
ER -