Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- Infineon Technologies AG Austria
- ESRF
- KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH
- Erich Schmid Institute of Materials Science
Details
Original language | English |
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Article number | 137576 |
Number of pages | 7 |
Journal | Thin solid films |
Volume | 691.2019 |
Issue number | 1 December |
DOIs | |
Publication status | E-pub ahead of print - 14 Oct 2019 |