Microstructure and mechanical properties of hierarchical multi-phase composites based on Al-Ni-type intermetallic compounds in the Al-Ni-Cu-Si alloy system
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- Erich Schmid Institute of Materials Science
- Sejong University
- Samsung Electronics Co. Ltd.
Details
| Original language | English |
|---|---|
| Pages (from-to) | 205-210 |
| Number of pages | 6 |
| Journal | Journal of alloys and compounds |
| Volume | 749.2018 |
| Issue number | 15 June |
| Early online date | 27 Mar 2018 |
| DOIs | |
| Publication status | Published - 15 Jun 2018 |
