Lock-in inductive thermography for surface crack detection
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Standard
Lock-in inductive thermography for surface crack detection. / Oswald-Tranta, Beata.
Thermosense: Thermal Infrared Applications XL. Vol. 10661 SPIE, 2018. 106610U.
Thermosense: Thermal Infrared Applications XL. Vol. 10661 SPIE, 2018. 106610U.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Harvard
Oswald-Tranta, B 2018, Lock-in inductive thermography for surface crack detection. in Thermosense: Thermal Infrared Applications XL. vol. 10661, 106610U, SPIE, Thermosense: Thermal Infrared Applications XL 2018, Orlando, United States, 16/04/18. https://doi.org/10.1117/12.2309365
APA
Oswald-Tranta, B. (2018). Lock-in inductive thermography for surface crack detection. In Thermosense: Thermal Infrared Applications XL (Vol. 10661). Article 106610U SPIE. https://doi.org/10.1117/12.2309365
Vancouver
Oswald-Tranta B. Lock-in inductive thermography for surface crack detection. In Thermosense: Thermal Infrared Applications XL. Vol. 10661. SPIE. 2018. 106610U doi: 10.1117/12.2309365
Author
Bibtex - Download
@inproceedings{c51a7640ca974acfab3446640a470d99,
title = "Lock-in inductive thermography for surface crack detection",
keywords = "Crack depth, Crack detection, Eddy current, Inductive thermography, Lock-in",
author = "Beata Oswald-Tranta",
year = "2018",
month = jan,
day = "1",
doi = "10.1117/12.2309365",
language = "English",
volume = "10661",
booktitle = "Thermosense",
publisher = "SPIE",
address = "United States",
note = "Thermosense: Thermal Infrared Applications XL 2018 ; Conference date: 16-04-2018 Through 19-04-2018",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Lock-in inductive thermography for surface crack detection
AU - Oswald-Tranta, Beata
PY - 2018/1/1
Y1 - 2018/1/1
KW - Crack depth
KW - Crack detection
KW - Eddy current
KW - Inductive thermography
KW - Lock-in
UR - http://www.scopus.com/inward/record.url?scp=85050813462&partnerID=8YFLogxK
U2 - 10.1117/12.2309365
DO - 10.1117/12.2309365
M3 - Conference contribution
AN - SCOPUS:85050813462
VL - 10661
BT - Thermosense
PB - SPIE
T2 - Thermosense: Thermal Infrared Applications XL 2018
Y2 - 16 April 2018 through 19 April 2018
ER -
