Lock-in inductive thermography for surface crack detection

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Lock-in inductive thermography for surface crack detection. / Oswald-Tranta, Beata.
Thermosense: Thermal Infrared Applications XL. Band 10661 SPIE, 2018. 106610U.

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Harvard

Oswald-Tranta, B 2018, Lock-in inductive thermography for surface crack detection. in Thermosense: Thermal Infrared Applications XL. Bd. 10661, 106610U, SPIE, Thermosense: Thermal Infrared Applications XL 2018, Orlando, USA / Vereinigte Staaten, 16/04/18. https://doi.org/10.1117/12.2309365

APA

Oswald-Tranta, B. (2018). Lock-in inductive thermography for surface crack detection. In Thermosense: Thermal Infrared Applications XL (Band 10661). Artikel 106610U SPIE. https://doi.org/10.1117/12.2309365

Vancouver

Oswald-Tranta B. Lock-in inductive thermography for surface crack detection. in Thermosense: Thermal Infrared Applications XL. Band 10661. SPIE. 2018. 106610U doi: 10.1117/12.2309365

Author

Oswald-Tranta, Beata. / Lock-in inductive thermography for surface crack detection. Thermosense: Thermal Infrared Applications XL. Band 10661 SPIE, 2018.

Bibtex - Download

@inproceedings{c51a7640ca974acfab3446640a470d99,
title = "Lock-in inductive thermography for surface crack detection",
keywords = "Crack depth, Crack detection, Eddy current, Inductive thermography, Lock-in",
author = "Beata Oswald-Tranta",
year = "2018",
month = jan,
day = "1",
doi = "10.1117/12.2309365",
language = "English",
volume = "10661",
booktitle = "Thermosense",
publisher = "SPIE",
address = "United States",
note = "Thermosense: Thermal Infrared Applications XL 2018 ; Conference date: 16-04-2018 Through 19-04-2018",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Lock-in inductive thermography for surface crack detection

AU - Oswald-Tranta, Beata

PY - 2018/1/1

Y1 - 2018/1/1

KW - Crack depth

KW - Crack detection

KW - Eddy current

KW - Inductive thermography

KW - Lock-in

UR - http://www.scopus.com/inward/record.url?scp=85050813462&partnerID=8YFLogxK

U2 - 10.1117/12.2309365

DO - 10.1117/12.2309365

M3 - Conference contribution

AN - SCOPUS:85050813462

VL - 10661

BT - Thermosense

PB - SPIE

T2 - Thermosense: Thermal Infrared Applications XL 2018

Y2 - 16 April 2018 through 19 April 2018

ER -