In-Situ compression tests on micron-sized copper pillars

Research output: Contribution to conferencePosterResearchpeer-review

Standard

In-Situ compression tests on micron-sized copper pillars. / Kiener, Daniel; Motz, Christian; Dehm, Gerhard.
2006. Poster session presented at Gordon Research Conference on thin film & small scale mechanical behavior, Waterville, Maine, United States.

Research output: Contribution to conferencePosterResearchpeer-review

Harvard

Kiener, D, Motz, C & Dehm, G 2006, 'In-Situ compression tests on micron-sized copper pillars', Gordon Research Conference on thin film & small scale mechanical behavior, Waterville, United States, 30/07/06 - 4/08/06.

APA

Kiener, D., Motz, C., & Dehm, G. (2006). In-Situ compression tests on micron-sized copper pillars. Poster session presented at Gordon Research Conference on thin film & small scale mechanical behavior, Waterville, Maine, United States.

Vancouver

Kiener D, Motz C, Dehm G. In-Situ compression tests on micron-sized copper pillars. 2006. Poster session presented at Gordon Research Conference on thin film & small scale mechanical behavior, Waterville, Maine, United States.

Author

Kiener, Daniel ; Motz, Christian ; Dehm, Gerhard. / In-Situ compression tests on micron-sized copper pillars. Poster session presented at Gordon Research Conference on thin film & small scale mechanical behavior, Waterville, Maine, United States.

Bibtex - Download

@conference{0c15f5cb33a744618118d1e1e8d32e05,
title = "In-Situ compression tests on micron-sized copper pillars",
author = "Daniel Kiener and Christian Motz and Gerhard Dehm",
year = "2006",
language = "English",
note = "Gordon Research Conference on thin film & small scale mechanical behavior ; Conference date: 30-07-2006 Through 04-08-2006",

}

RIS (suitable for import to EndNote) - Download

TY - CONF

T1 - In-Situ compression tests on micron-sized copper pillars

AU - Kiener, Daniel

AU - Motz, Christian

AU - Dehm, Gerhard

PY - 2006

Y1 - 2006

M3 - Poster

T2 - Gordon Research Conference on thin film & small scale mechanical behavior

Y2 - 30 July 2006 through 4 August 2006

ER -