Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates

Research output: Contribution to journal › Article › Research › peer-review

Standard

Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates. / Samusjew, Aleksandra; Lassnig, Alice ; Cordill, Megan J. et al.
In: Advanced Materials Technologies, Vol. 3, No. 4, 1700250, 01.04.2018.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Samusjew, A, Lassnig, A, Cordill, MJ, Krawczyk, K & Grießer, T 2018, 'Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates', Advanced Materials Technologies, vol. 3, no. 4, 1700250. https://doi.org/10.1002/admt.201700250

APA

Samusjew, A., Lassnig, A., Cordill, M. J., Krawczyk, K., & Grießer, T. (2018). Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates. Advanced Materials Technologies, 3(4), Article 1700250. https://doi.org/10.1002/admt.201700250

Vancouver

Samusjew A, Lassnig A, Cordill MJ, Krawczyk K, Grießer T. Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates. Advanced Materials Technologies. 2018 Apr 1;3(4):1700250. doi: 10.1002/admt.201700250

Author

Samusjew, Aleksandra ; Lassnig, Alice ; Cordill, Megan J. et al. / Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates. In: Advanced Materials Technologies. 2018 ; Vol. 3, No. 4.

Bibtex - Download

@article{e0ca0b626d7d43b993cfe812af40cdfb,
title = "Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates",
keywords = "biodegradable electronics, cellulose, inkjet printing, printed electronics, printed wiring boards, vertical interconnect access",
author = "Aleksandra Samusjew and Alice Lassnig and Cordill, {Megan J.} and Krzysztof Krawczyk and Thomas Grie{\ss}er",
year = "2018",
month = apr,
day = "1",
doi = "10.1002/admt.201700250",
language = "English",
volume = "3",
journal = "Advanced Materials Technologies",
publisher = "Wiley-VCH ",
number = "4",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates

AU - Samusjew, Aleksandra

AU - Lassnig, Alice

AU - Cordill, Megan J.

AU - Krawczyk, Krzysztof

AU - Grießer, Thomas

PY - 2018/4/1

Y1 - 2018/4/1

KW - biodegradable electronics

KW - cellulose

KW - inkjet printing

KW - printed electronics

KW - printed wiring boards

KW - vertical interconnect access

UR - http://www.scopus.com/inward/record.url?scp=85038353333&partnerID=8YFLogxK

U2 - 10.1002/admt.201700250

DO - 10.1002/admt.201700250

M3 - Article

AN - SCOPUS:85038353333

VL - 3

JO - Advanced Materials Technologies

JF - Advanced Materials Technologies

IS - 4

M1 - 1700250

ER -

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