Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates. / Samusjew, Aleksandra; Lassnig, Alice ; Cordill, Megan J. et al.
in: Advanced Materials Technologies, Jahrgang 3, Nr. 4, 1700250, 01.04.2018.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Bibtex - Download

@article{e0ca0b626d7d43b993cfe812af40cdfb,
title = "Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates",
keywords = "biodegradable electronics, cellulose, inkjet printing, printed electronics, printed wiring boards, vertical interconnect access",
author = "Aleksandra Samusjew and Alice Lassnig and Cordill, {Megan J.} and Krzysztof Krawczyk and Thomas Grie{\ss}er",
year = "2018",
month = apr,
day = "1",
doi = "10.1002/admt.201700250",
language = "English",
volume = "3",
journal = "Advanced Materials Technologies",
publisher = "Wiley-VCH ",
number = "4",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates

AU - Samusjew, Aleksandra

AU - Lassnig, Alice

AU - Cordill, Megan J.

AU - Krawczyk, Krzysztof

AU - Grießer, Thomas

PY - 2018/4/1

Y1 - 2018/4/1

KW - biodegradable electronics

KW - cellulose

KW - inkjet printing

KW - printed electronics

KW - printed wiring boards

KW - vertical interconnect access

UR - http://www.scopus.com/inward/record.url?scp=85038353333&partnerID=8YFLogxK

U2 - 10.1002/admt.201700250

DO - 10.1002/admt.201700250

M3 - Article

AN - SCOPUS:85038353333

VL - 3

JO - Advanced Materials Technologies

JF - Advanced Materials Technologies

IS - 4

M1 - 1700250

ER -