Entfernung organischer Zusätze aus Abwässern der Leiterplattenindustrie
Research output: Thesis › Master's Thesis
Authors
Organisational units
Abstract
An important part of every electronic device are printed circuit boards. They establish an electric connection between the various electrical components. To set this electric connection copper is electrolytically coated onto carrier plates. In order to guarantee an optimized copper deposition on printed circuit boards various organic additives are added to the plating baths. To be able to electrolytically recycle copper sulfate wastewater which is produced during the manufacturing of printed circuit boards the organic bath additives have to be removed beforehand. These additives are necessary for the production of circuit boards but are harmful for the electrolysis process. This work focuses on two different possibilities to accomplish this goal, the removal of the organics with activated carbon and the oxidation of the organics with an electrochemical cell. The two processes have been examined theoretically and then experimentally with test systems in a laboratory-scale. The experiments for the activated charcoal have shown that in principle a large part of the TOC-content can be removed. Between the different activated charcoals significant difference in effectiveness have been shown. The carbon with the least efficiency only removed 32 % of the total organic carbon, the best removed 73 %. Also in terms of capacity different values where obtained for different activated carbons, from 44 g organics per l of charcoal to 59 g/l. The treatment of the electrolyte with electrochemical oxidation did not alter the TOC-content greatly. However, by examine the media by means of the Hull cell an influence on the copper build-up and therefore on the function of the organics could be demonstrated.
Details
Translated title of the contribution | Removal of organic additives from wastewater of the printed circuit board industry |
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Original language | German |
Qualification | Dipl.-Ing. |
Awarding Institution | |
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Award date | 30 Jun 2023 |
DOIs | |
Publication status | Published - 2023 |