Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
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In: Materials, Vol. 12.2019, No. 3, 550, 12.02.2019.
Research output: Contribution to journal › Review article › peer-review
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TY - JOUR
T1 - Copper/Epoxy Joints in Printed Circuit Boards
T2 - Manufacturing and Interfacial Failure Mechanisms
AU - Nothdurft, Philipp
AU - Rieß, Gisbert
AU - Kern, Wolfgang
PY - 2019/2/12
Y1 - 2019/2/12
N2 - Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
AB - Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
KW - Circuit boards
KW - Copper/epoxy joints
KW - Electronic industry
KW - Failure analysis
KW - Printed
KW - State of the art
UR - http://www.scopus.com/inward/record.url?scp=85061484759&partnerID=8YFLogxK
U2 - 10.3390/ma12030550
DO - 10.3390/ma12030550
M3 - Review article
AN - SCOPUS:85061484759
VL - 12.2019
JO - Materials
JF - Materials
SN - 1996-1944
IS - 3
M1 - 550
ER -