TY - JOUR

T1 - Copper/Epoxy Joints in Printed Circuit Boards

T2 - Manufacturing and Interfacial Failure Mechanisms

AU - Nothdurft, Philipp

AU - Rieß, Gisbert

AU - Kern, Wolfgang

PY - 2019/2/12

Y1 - 2019/2/12

N2 - Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

AB - Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

KW - Circuit boards

KW - Copper/epoxy joints

KW - Electronic industry

KW - Failure analysis

KW - Printed

KW - State of the art

UR - http://www.scopus.com/inward/record.url?scp=85061484759&partnerID=8YFLogxK

U2 - 10.3390/ma12030550

DO - 10.3390/ma12030550

M3 - Review article

AN - SCOPUS:85061484759

VL - 12.2019

JO - Materials

JF - Materials

SN - 1996-1944

IS - 3

M1 - 550

ER -