Control of bonding and epitaxy at copper/sapphire interface
Research output: Contribution to journal › Article › Research › peer-review
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Control of bonding and epitaxy at copper/sapphire interface. / Oh, S.H.; Scheu, Christina; Wagner, T. et al.
In: Applied physics letters, Vol. 91, 2007, p. 141912-1-141912-3.
In: Applied physics letters, Vol. 91, 2007, p. 141912-1-141912-3.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Oh, SH, Scheu, C, Wagner, T & Rühle, M 2007, 'Control of bonding and epitaxy at copper/sapphire interface', Applied physics letters, vol. 91, pp. 141912-1-141912-3. https://doi.org/10.1063/1.2794025
APA
Oh, S. H., Scheu, C., Wagner, T., & Rühle, M. (2007). Control of bonding and epitaxy at copper/sapphire interface. Applied physics letters, 91, 141912-1-141912-3. https://doi.org/10.1063/1.2794025
Vancouver
Oh SH, Scheu C, Wagner T, Rühle M. Control of bonding and epitaxy at copper/sapphire interface. Applied physics letters. 2007;91:141912-1-141912-3. doi: 10.1063/1.2794025
Author
Bibtex - Download
@article{6f7c47b1081a4b8a90324c232c8e8349,
title = "Control of bonding and epitaxy at copper/sapphire interface",
author = "S.H. Oh and Christina Scheu and T. Wagner and M. R{\"u}hle",
year = "2007",
doi = "10.1063/1.2794025",
language = "English",
volume = "91",
pages = "141912--1--141912--3",
journal = "Applied physics letters",
issn = "0003-6951",
publisher = "American Institute of Physics Publising LLC",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Control of bonding and epitaxy at copper/sapphire interface
AU - Oh, S.H.
AU - Scheu, Christina
AU - Wagner, T.
AU - Rühle, M.
PY - 2007
Y1 - 2007
U2 - 10.1063/1.2794025
DO - 10.1063/1.2794025
M3 - Article
VL - 91
SP - 141912-1-141912-3
JO - Applied physics letters
JF - Applied physics letters
SN - 0003-6951
ER -
